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0.3mm Pitch 9-71Pin Zif R/A SMT H=0.9 Backflip Dual Contact High Temperature Thermoplastic FPC Connector PCB

0.3mm Pitch 9-71Pin Zif R/A SMT H=0.9 Backflip Dual Contact High Temperature Thermoplastic FPC Connector PCB

Place of Origin:

Guangdong,China

Brand Name:

XTKCONN

Certification:

CE,SGS,ROHS,ISO9001

Model Number:

FPC**-T1T1-00**-C

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Request A Quote
Product Details
Material:
LCP
Terminal Material:
Phosphor Bronze,Gold Plating
Type:
FFC & FPC Connector
Application:
PCB
Package:
Reel Packaging
Picth:
0.3mm
Payment & Shipping Terms
Minimum Order Quantity
10pcs
Price
Negotiable price
Packaging Details
vacuum package,boxes in carton
Delivery Time
5-7 days
Payment Terms
L/C,T/T,Payyal
Supply Ability
4KK pcs
Product Description

0.3mm Pitch 9- 71 Pin ZIF R/A SMT H=0.9 Backflip Dual Contact High Temperature Thermoplastic FPC Connector PCB


Product Highlights

Ultra‑low 0.9 mm mated height right‑angle SMT FPC connector, 0.3 mm pitch, 9‑71 positions, and a back‑flip ZIF locking mechanism with stable ZIF/non-ZIF switchable locking performance. Dual upper‑side contact design delivers superior anti‑vibration performance and passes the 3‑axis vibration test without intermittent signal dropout. High‑temperature thermoplastic housing supports standard SMT reflow, ideal for slim compact display & sensor modules, RoHS & halogen‑free compliant

.


Full Technical Specifications

Electrical Specifications

Item Specification
Rated Current 0.2 A per pin
Rated Voltage 30 V DC
Max. Contact Resistance ≤80 mΩ
Insulation Resistance ≥1000 MΩ @ DC 100V
Withstand Voltage 150 V AC / 1 min, no breakdown


Mechanical Performance Parameters

Item Specification
Pitch 0.3 mm
Pin Range 9‑71 Pin
Mount Type Right‑Angle SMT
Mated Height 0.9 mm
Actuator Type Back‑flip ZIF
Contact Structure Dual Upper Contact
Mating Cycles Min. 30 cycles
FPC Thickness Compatible 0.2 mm standard FPC
Vibration Test 10‑55Hz 3‑axis, no ≥1μs discontinuity


Material & Plating / Environment & Soldering

Item Specification
Housing Material High‑temperature thermoplastic, UL94‑V0
Contact Material Phosphor Bronze
Contact Plating Gold‑plated mating area; nickel under‑plating
Operating Temperature ‑40 ℃ ~ +85 ℃
SMT Reflow Profile Peak temp 260 ℃ ±5 ℃, dwell ≤5 s
Hand Soldering (Prototype Only) ≤350 ℃, soldering time ≤3 s
Compliance RoHS, Halogen‑Free

Compatible / Replacement for International Major Brands

Direct drop‑in functional replacement for Hirose FH35C series, Molex 502598 series, TE 3‑2328724 series 0.3 mm pitch back‑flip ZIF dual‑contact FPC connectors.

0.3mm Pitch 9-71Pin Zif R/A SMT H=0.9 Backflip Dual Contact High Temperature Thermoplastic FPC Connector PCB

0.3mm Pitch 9-71Pin Zif R/A SMT H=0.9 Backflip Dual Contact High Temperature Thermoplastic FPC Connector PCB




Product Features

  • 0.3 mm contact pitch, pin count configurable 9- 71 pins, right‑angle SMT mounting
  • Back‑flip ZIF locking actuator, tactile click feedback for clear lock‑in confirmation; supports ZIF / Non‑ZIF operation mode
  • Dual upper‑side contact structure: two‑point contact improves FPC retention, avoids signal loss under vibration
  • Ultra‑low 0.9 mm mated height, helps designers realize ultra‑slim end‑product mechanical layout
  • High‑temperature thermoplastic insulator, compatible with standard SMT reflow soldering process
  • Accepts industry‑standard 0.2 mm thickness FPC; entry chamfer guides prevent wrong FPC insertion
  • Passes strict 3‑axis vibration test; no> 1 μs electrical discontinuity under vibration conditions
  • RoHS‑compliant, halogen‑free; customizable plating thickness, polarization key, partial pin assignment

0.3mm Pitch 9-71Pin Zif R/A SMT H=0.9 Backflip Dual Contact High Temperature Thermoplastic FPC Connector PCB

Factory Certification & Custom Service

  • Factory Certifications: ISO9001, ISO14001, RoHS, Halogen‑Free compliance
  • MOQ: Standard reel MOQ 5000 pcs; small‑lot trial‑order negotiable
  • Sample Policy: Support free samples / fast sample delivery
  • Customization: Custom pin‑count, plating thickness, polarization key, special mechanical modification according to customer drawing or specification

Packaging Method

  • Reel (Tape & Reel): Standard packing, suitable for SMT automatic pick‑and‑place machine, directly feeds to customer assembly line.
  • Tube packaging: Available for small‑lot sample / manual prototype assembly; not fit for high‑volume automatic SMT production.

Lead Time

  • Sample order: 3 working days
  • Mass production order: 1‑3 weeks, subject to quantity & custom requirements


0.3mm Pitch 9-71Pin Zif R/A SMT H=0.9 Backflip Dual Contact High Temperature Thermoplastic FPC Connector PCB

Target Application Industries

  • Compact display modules: small‑size LCD, OLED screen connection
  • Camera modules for handheld & portable equipment
  • Wearable electronics: smart watch, smart glasses
  • Medical portable detection instruments
  • IoT handheld terminals, barcode scanners
  • Small‑size consumer electronics, handheld testing devices

0.3mm Pitch 9-71Pin Zif R/A SMT H=0.9 Backflip Dual Contact High Temperature Thermoplastic FPC Connector PCB


Main differences between FFC connector and FPC


In terms of their manufacturing, the way their circuits are formed is different:

1. FPC is a kind of flexible circuit board with different single-sided, double-sided, and multilayer structures, which is processed by FCCL (flexible copper-clad foil) by chemical etching.

2. FFC uses two layers of insulating foil film sandwiched with flat copper foil. The finished product is simple and thick.

0.3mm Pitch 9-71Pin Zif R/A SMT H=0.9 Backflip Dual Contact High Temperature Thermoplastic FPC Connector PCB



FPC future innovation trend


1. Thickness. The thickness of FPC must be more flexible and thinner.

2. Folding resistance. Bending is an inherent characteristic of FPC. The bending resistance of future FPCs must be stronger and must be more than 10 thousand times. Of course, this requires better substrates.

3. Price. At this stage, the price of FPC is much higher than that of PCB. If the price of FPC goes down, the market will be wider.

4. Process level. In order to meet various requirements, the FPC process must be upgraded, and the minimum aperture and minimum linewidth/line spacing must meet higher requirements.



0.3mm Pitch 9-71Pin Zif R/A SMT H=0.9 Backflip Dual Contact High Temperature Thermoplastic FPC Connector PCB

FAQs


1, Can I have a sample order?
Yes, we welcome sample orders to test and check quality. Mixed samples are acceptable.


2, Can you make your products according to our demand?
Yes, the specifications of products can be customized if you can meet our MOQ.


3, How to guarantee the quality of your products?
1) We promise that within 30 days of quality problems, we will give you a return.

2) Strict detection during production.

3 ) Strict sampling inspection on products before shipment, and intact product packaging ensured.


4, What are our product certifications?
ISO9001 and some other ROHS certifications.


5, How long can I get the goods?
Most goods we have in stock; delivery time is about 1-5 days after receiving payment. For customized requirements, the time will be a little longer, as we confirmed.


6, What kind of logistics do you use for delivery?
We mainly deliver goods by DHL, UPS, FEDEX, EMS, and other express delivery. We will choose the most cost-effective logistics for customers. Also supported goods picked by your forwarder.


7, Why should you buy from us?
We have 16 years of industry experience. We have cooperation with thousands of companies. Product quality is reliable.


8, What products does your company mainly sell?
Our company's main products include FFC/FPC connectors / Wafer connector /SIM card connector / Memory card connector / USB connector / Type C connector / HDMI connector / RJ45 series / B to B connector and Pin header connectors and so on.


Send your inquiry directly to us

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