2.54-2xnPLB-H=8.8-SMT=10.5-SS Box Header 2.54mm 3.0AMP Electronic Components

Highlight

• 2.54 mm standard pitch dual‑row SMT shrouded box header, overall height H=8.8 mm, total PCB profile 10.5 mm, stainless steel reinforcement structure (SS) for anti‑deformation
• 3.0 A per pin continuous rating, 0.64 mm square brass contacts, optional gold / tin‑over‑nickel plating for signal‑critical or cost‑sensitive PCBA
• Polarized shroud housing prevents reverse mating; optimized pick‑and‑place footprint for high‑volume SMT reflow assembly
• UL94V‑0 high‑temperature PA6T insulator, RoHS‑REACH compliant, pin count configurable 6P‑64P for wire‑to‑board / board‑to‑board interconnection

Product Description

General Mechanical Parameters

Material & Electrical Characteristics

Environment & Soldering Guide

Product Features

1. Stainless‑steel reinforced shroud shell resists housing distortion during assembly and field vibration
2. SMT surface‑mount termination, tailored for tape‑and‑reel auto‑placement; no through‑hole drilling required on PCB
3. Built‑in polarization key eliminates reverse insertion risk, avoids circuit damage caused by mis‑mating
4. 0.64 mm square brass contacts provide stable contact force; multiple plating options (flash gold, 3 μ″ gold, tin‑nickel) available
5. High‑temp PA6T UL94V‑0 insulator withstands lead‑free reflow thermal stress
6. Modular pin‑count range: 6P ~ 64P dual‑row, support OEM pin‑number customization
7. RoHS & REACH compliant, low‑halogen option available for industrial & medical projects

Product Advantage

1. SS stainless steel reinforcement: Compared to ordinary plastic‑only box headers, anti‑twist and anti‑shock performance improves for vibration‑prone industrial devices, reducing housing crack risk during pick‑and‑place.
2. Precise 10.5 mm total height: Matches mechanical clearance requirements of many legacy 2.54 mm IDC systems; drop‑in replacement for mainstream market box headers without PCB redesign.
3. Balanced electrical performance: 3 A per‑pin rating covers both signal and low‑power power lines; flexible plating selections cut BOM cost for non‑high‑speed scenarios while supporting gold plating for high‑reliability signal circuits.
4. SMT‑optimized geometry: Stable solder footprint reduces tomb‑stoning risk in mass production; tape‑and‑reel packing directly feeds SMT machines, cutting manual labor cost.
5. Quick sample support: Custom pin counts and plating thickness can be sampled in short lead‑time for engineering validation.

Application

• Industrial control boards, PLC peripheral modules
• IoT gateway, sensor acquisition modules
• Medical auxiliary electronic equipment
• Smart home control mainboards
• Test & measurement instrument PCBA
• Communication terminal internal wire‑to‑board interconnection
• Automation equipment signal connection

Customization Options

1. Confirm required pin count: dual‑row, total pins from 6P‑64P; specify exact pin number when placing inquiry.
2. Plating selection:
   • Tin‑Nickel: cost‑optimized, general‑purpose signal circuits, normal humidity environment
   • 3 μ″ Gold over Nickel: preferred for vibration, high‑temperature or long‑life service condition
3. Mechanical check: verify 10.5 mm total height clearance inside your enclosure; ensure mating partner is standard 2.54 mm IDC ribbon cable socket.
4. Assembly: select Tape&Reel for auto‑SMT; Tray/Tube for small‑batch prototype.
5. Special requirement: notify us if low‑halogen or medical‑grade material is needed.