2.54mm Pitch DIN Brass Female Header Connector Dual Row Stack 2mm H2.0 PCB Nylon 600V 3A H12.5mm 2*4P

Highlight

• Standard 2.54mm(0.100") DIN pitch, dual‑row stackable 2*4P layout, total height H12.5mm, stacking height 2.0mm
• Brass contact terminal, Nylon UL94V‑0 housing, rated 3A / 600V for signal & low‑power board‑to‑board stacking connection
• Optimized mechanical retention, stable contact performance, compatible with mainstream 2.54mm male pin headers
• RoHS & REACH compliant, supports custom plating, pin‑count and post modification for industrial & consumer PCB projects

Product Description

General Mechanical Parameters

Material & Electrical Characteristics

Environment & Soldering Guide

Product Features

1. Stack‑to‑stack mezzanine design, H12.5mm total height, 2.0 mm stacking clearance for multi‑layer PCB stacking layout
2. High‑conductivity brass contact beams, consistent spring force to minimize contact resistance over repeated mating cycles
3. Nylon UL94V‑0 flame‑retardant housing, excellent resistance to thermal shock during wave‑reflow soldering
4. Strict DIN 2.54 mm pitch tolerance, perfect interoperability with industry‑standard 2.54 mm male pin headers
5. 3A / 600V electrical rating, handles mixed signal and low‑power power‑supply transmission
6. Through‑hole PCB mounting; optional locating posts available for anti‑misalignment during assembly
7. RoHS‑compliant raw materials; contact plating customizable: tin, gold flash, selective gold plating upon request

Product Advantage

1. Stack‑optimized dimension: H12.5 mm body + 2.0 mm stacking height, solves height‑mismatch pain point for multi‑layer daughter‑board stacking, no extra spacer needed.
2. Brass contact beam: Superior spring retention compared to ordinary copper alloy, lower risk of loose connection under vibration in industrial scenarios.
3. Nylon housing: Better thermal stability vs PBT, less deformation during wave‑soldering for high‑volume PCBA production.
4. DIN‑standard pitch: Strict dimensional consistency, zero rework risk when replacing Molex / TE equivalent 2.54 mm stack female headers.
5. Flexible customization: Adjust pin‑count, plating and locating post without high NRE cost; support small‑batch prototype and mass‑production orders.

Application

• Industrial control: PLC peripheral modules, data‑acquisition boards, relay control units
• Embedded hardware: Development boards, MCU expansion shields, IoT sensor gateway stacking modules
• Consumer electronics: Smart home control panels, LED driver boards, small‑size power‑supply assemblies
• Instrument & Meter: Test equipment, handheld measuring devices, medical auxiliary PCB sub‑boards
• Automotive auxiliary electronics: Non‑safety signal expansion board, in‑vehicle sensor connection modules

Customization Options

1. Confirm stacking height requirement: This model provides 2.0 mm stack gap; contact us if you need alternative stack height.
2. Electrical load: Keep per‑pin current below 3A; use higher‑current connector if power‑line exceeds this rating.
3. Plating selection: Choose gold‑flash plating for high‑vibration / humid environment; tin‑plating for cost‑sensitive indoor consumer projects.
4. PCB footprint: Strictly follow 2.54 mm dual‑row through‑hole footprint; enable locating post if your assembly requires anti‑offset.
5. Mating counterpart: Match with standard 2.54 mm dual‑row male pin header; avoid mixing non‑standard pitch counterparts.
6. Temperature scenario: For continuous working above 85 ℃, recommend gold‑plated contacts to prevent oxidation‑caused intermittent signal.