1.27mm Female Communication Connector 4x25P H5.08 SMT Y-Type Full Gold 1u For PCBA

Highlight

• 1.27mm fine‑pitch Y‑type female receptacle, 4×25P high‑density layout, stacking height H5.08mm for compact PCB‑to‑board interconnection
• Full gold plating 1μm over nickel base, stable 2.4A per‑pin current & 200V rated voltage for signal & low‑power mixed transmission
• SMT surface‑mount design, black high‑temp insulator, roll‑up tape‑reel packaging, direct pick‑and‑place for high‑speed SMT assembly lines
• Optimized Y‑shape contact beam structure: lower insertion force, stable contact resistance, anti‑vibration performance for industrial embedded hardware

Product Description

General Mechanical Parameters

Material & Electrical Characteristics

Environment & Soldering Guide

Product Features

1. Y‑type spring contact structure: moderate insertion‑extraction force, good shock & vibration resistance, keep low & stable contact resistance under long‑term vibration environment
2. 4 rows ×25 pins high‑density arrangement, 1.27mm pitch, H5.08mm stacking height, save valuable PCB layout space
3. 1μm full gold plating on contact area, anti‑oxidation, excellent conductivity, reduce signal attenuation for long‑term operation
4. SMT surface‑mount termination, black high‑temperature‑resistant plastic housing, pass reflow soldering process without deformation
5. Roll‑up tape‑reel packaging, standard carrier tape, support mass automatic mounting, cut manual loading error & labor cost
6. RoHS & REACH compliant; customizable pin count, plating thickness and mechanical locating bosses upon request

Product Advantage

1. Y‑beam contact differentiation: Compared with ordinary straight‑arm SMT sockets, Y‑shaped contact beam provides multi‑point contact, improves anti‑loosening performance under vibration, reduces field failure risk for industrial equipment
2. 1μm full‑gold contact: Distinct from gold‑flash cheap alternatives; uniform gold layer avoids contact corrosion, maintains signal integrity for long‑life communication hardware
3. 4×25P high‑density layout: Concentrates multi‑channel signal links in limited PCB footprint, helps engineers shrink whole‑machine dimension
4. Roll‑up reel ready‑for‑mass‑production: No tube‑pack manual sorting, fit high‑volume SMT production, lower your assembly cost and improve throughput
5. Strict consistency control: Stable dimension tolerance, good coplanarity for SMT pins, reduce bad‑soldering rate in mass production

Application

• Communication equipment: industrial communication modules, network access units, signal switching boards
• Industrial control: PLC peripheral boards, sensor aggregation modules, factory automation controller
• Embedded system: industrial mainboard, edge computing hardware
• IoT & smart hardware: high‑density signal collection equipment
• Medical electronics (non‑implant): test & measuring instrument internal board‑to‑board connection

Customization Options

1. Confirm stacking height: H5.08 mm defines board‑to‑board gap; verify mechanical clearance between two PCBs before selecting.
2. Electrical check: single‑pin max 2.4A / 200V; do not exceed rating for power‑mixed signal circuits.
3. Mating part: must pair with a 1.27mm pitch matching male header; mismatched pitch will cause pin damage and poor contact.
4. Assembly mode: choose this roll‑up reel version if you run full‑automatic SMT lines; we can supply tube packing for small‑batch prototype builds.
5. Plating note: 1μm gold fits long‑service‑life industrial / communication scenarios; for low‑cost consumer‑grade projects, consult us for gold‑flash alternative part numbers.
6. Mechanical environment: if your device faces heavy vibration, confirm the PCB adds locating bosses to strengthen connector fixation.