Place of Origin:
Guangdong China
Brand Name:
XTKCONN
Certification:
CE,SGS,ROHS,ISO9001
Model Number:
Wafer Housing Terminal
0.5mm H2.55 HRS 60V AC/DC Industrial FPC Connector
This 0.5mm pitch FPC connector features a 2.55mm low-profile height design, combined with a right-angle SMT configuration and a front flip locking mechanism. The bottom contact structure is engineered to optimize PCB layout space while ensuring a stable electrical connection for flexible flat cables.
It is widely used in LCD modules, industrial control systems, consumer electronics, and embedded devices requiring high-density FPC interconnection.
Description
This series of FPC/FFC Connectors is designed for applications such as GPSs and AV equipment for automobile use or electronics for industrial and/or medical use, which require resistance to vibration. These products are 0.5m pitch, bottom contact, right-angle, SMT, ZIF connectors with front locking. Their structures prevent FPCs/FFCs from becoming disjointed or inserted aslant. We also offer a 1mm pitch type.
| Pitch | 0.5mm | |
| Height | 2.55mm | 8-10-12-20-24-30-40-50-60-68pin available |
| Mounting Type | SMT/ZIF | |
| Contact Location | Bottom contact | |
| Type | Front lock | |
| Current Rating | 0.5A/Pin Max | |
| Voltage Rating | 50V AC/DC MAX | |
| Withstanding Voltage | 250V AC,1min | |
| Cover Material | LCP UL94V-0 black | |
| Housing | LCP UL94V-0 Natural | |
| Terminal/Contact | Copper alloy | |
| Plating | Gold-plating | |
| Operation Temperature | -40℃ to +85℃ | |
| Lead Time | 7-10 working Days | |
The 0.5mm fine-pitch layout supports multiple signal channels within limited PCB space, making it suitable for compact and lightweight electronic devices.
The 2.55mm height reduces vertical stacking constraints, ideal for ultra-thin display modules and compact PCB architectures.
The horizontal mounting design improves routing flexibility and reduces mechanical stress on FPC cables.
The front flip structure ensures secure cable insertion and stable mechanical locking, improving assembly consistency.
Bottom contact architecture helps optimize PCB routing space and minimizes interference from top-side components.
Typical Applications
LCD / OLED display modules
Consumer electronics (tablets, cameras, smart devices)
Industrial control systems
Embedded electronics
Medical display modules
Processing steps
Stamping / Injection -> pre-line inspection -> automatic machine plug terminal -> assembled back cover -> electrical test -> pressure test ->flatness test-->appearance test-->FQC test-->storage.
Main export markets
Packaging & Shipment
FOB Port: Shenzhen
Lead time:7 working days
Packaging: reel in carton
Payment
Payment Method: advance TT, T/T, L/C, Paypal, etc;
Delivery details:7-10working days after having confirmed the order
Primary Competitive Advantages
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