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Ultrathin 1.25mm Pitch Horizontal Wafer Box Connector Wire To Board

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China Shenzhen Xietaikang Precision Electronic Co., Ltd. certification
China Shenzhen Xietaikang Precision Electronic Co., Ltd. certification
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Ultrathin 1.25mm Pitch Horizontal Wafer Box Connector Wire To Board

Ultrathin 1.25mm Pitch Horizontal Wafer Box Connector Wire To Board
Ultrathin 1.25mm Pitch Horizontal Wafer Box Connector Wire To Board
Ultrathin 1.25mm Pitch Horizontal Wafer Box Connector Wire To Board Ultrathin 1.25mm Pitch Horizontal Wafer Box Connector Wire To Board Ultrathin 1.25mm Pitch Horizontal Wafer Box Connector Wire To Board

Large Image :  Ultrathin 1.25mm Pitch Horizontal Wafer Box Connector Wire To Board

Product Details:
Place of Origin: Guangdong,China
Brand Name: XTKCONN
Certification: CE,SGS,ROHS,ISO9001
Model Number: Wafer housing
Payment & Shipping Terms:
Minimum Order Quantity: 600pcs
Price: Negotiable price
Packaging Details: inner package:in reel; Outer Package: reel in Carton
Delivery Time: 5-7 days
Payment Terms: L/C, T/T,Payyal
Supply Ability: 3KK pcs

Ultrathin 1.25mm Pitch Horizontal Wafer Box Connector Wire To Board

Description
Pitch: 1.25mm Mounting Type: SMT,right Angle
Rated Current: 1.0A AC Rated Voltage: 125V AC/DC
Contact Resistance: 20m Ohms MAX Insulation Resistance: 100m Ohms Min
High Light:

1.25mm Wafer Box Connector

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Ultrathin Wafer Box Connector

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Horizontal 1.25 mm wafer connector

Ultrathin Type 1.25mm Pitch Horizontal Wafer Connector Wire To Board Connector

 

 

Product Description

 

Mounting Type SMT
Pitch 1.25mm
No. Of Positions 2-15p
Rated current 1.0A AC
Rated voltage 125V AC/DC
Contact Resistance 20m ohms MAX
Insulation Resistance 100m ohms min
Insertion Force 20gf/pin Min
Operation Temperature -25℃ to +85℃
Withstanding Voltage 500V/1min AC
Housing LCP UL94V-0
Contact Brass Tin-plated
Gender Female
Price Term FOB
Durability cycles 5000 Cycles Min
Lead Time 7-10 working Days

 

Ultrathin 1.25mm Pitch Horizontal Wafer Box Connector Wire To Board 0

 

Drawing

Ultrathin 1.25mm Pitch Horizontal Wafer Box Connector Wire To Board 1

 

Features

 

1.25mm-pitch connector system provides design flexibility with multiple header options, making it ideal for a variety of applications across many industries.

Wafer connector is offered in wire-to-board options. The system saves about 45% of PCB space compared to typical 2.00mm wire-to-board systems. It is a single row system, available in 2 to 15 circuits, with both surface mount and through-hole headers.

A full range of automatic, semi-automatic and manual tooling is available to support crimp harness assembly using discrete wires.

 

Description


1. The insulation resistance is the index to measure the insulation performance between the contacts of electrical connector and between the contacts and the shell, with the order of magnitude ranging from hundreds of megohm to gigaohm.
2. Electrical connector with high contact resistance shall have low and stable contact resistance. The contact resistance of the connector varies from a few milliohms to tens of milliohms.
3. Electrical strength, or voltage and dielectric withstand voltage, is the ability to withstand rated test voltage between connector contacts or between contacts and shell.
4. Other electrical performance.

 

What we can do


1. All of our products will be 100% inspected before shipment.
2. We can design products according to customer demand.
3. Support imprint your logo on products.

Contact Details
Shenzhen Xietaikang Precision Electronic Co., Ltd.

Contact Person: Tina

Tel: 86 13711847246

Fax: 86-769-85150486

Send your inquiry directly to us (0 / 3000)