Place of Origin:
Guangdong,China
Brand Name:
XTKCONN
Certification:
CE,SGS,ROHS,ISO9001
Model Number:
FPC**-T1S1-0010-A
Specifications
| Item | Specification | Remarks for Engineer |
|---|---|---|
| Pitch | 0.5 mm | Center‑to‑center contact spacing |
| Number of Positions | 4 Pin | Custom pin count negotiable |
| Mounting Height | 1.0 mm | Total height after soldered on PCB |
| Contact Type | Down‑Contact (Bottom Contact) | FPC pad faces PCB side for insertion |
| Lock Style | Under‑Lock (Back Flip Lock) | Flip actuator from rear side to lock FPC |
| Termination Type | SMT Surface Mount | For reflow soldering only |
| Compatible FPC / FFC Thickness | 0.30 mm ±0.03 mm | Confirm FPC thickness before PCB design |
| FPC Retention Force | ≥0.3 N per pin | Anti‑pull‑out performance under vibration |
| Mating Durability | Minimum 250 cycles | Normal application lifecycle, not for frequent field plug‑unplug |
| Housing Material | LCP, UL94‑V0 Black | High heat‑resistant for lead‑free reflow soldering |
| Contact Material | Copper Alloy | High spring‑beam elasticity |
| Contact Plating | Ni under‑plate + Au plating on contact area; Tin on SMT solder tails | Gold thickness adjustable for corrosive‑environment projects |
![]()
![]()
![]()
Typical Applications
----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Send your inquiry directly to us