Shorten Type UL94V-0 Micro SD Card Socket Middle Pin 1.5h TF Card Socket

Highlights

• Low‑profile 1.5 mm total height, shortened-type compact footprint, middle‑pin layout for optimized PCB routing flexibility
• Housing material LCP with UL94V‑0 flame retardant rating, satisfies fire‑safety requirement for industrial & smart hardware projects
• Selective gold plating on contact area, stable signal transmission for UHS‑I micro SD / TF cards
• SMT surface‑mount design, fully compatible with high‑volume automated reflow production line
• Built‑in card‑detect switch, real‑time card presence identification for system firmware logic
• RoHS‑compliant, stable mass‑supply capacity, support OEM / ODM pin‑layout & plating customization
• Optimized mechanical retention force, anti‑mis‑insertion structure, reduce on‑site intermittent‑recognition failure risk

Product Features

1. Ultra‑low 1.5 mm stacked height, shorten body size, save precious PCB enclosure Z‑axis & X‑Y space
2. Middle‑pin terminal assignment: flexible routing, easier differential signal layout, good for high‑speed SDIO/SPI signal integrity
3. LCP high‑temp plastic housing, UL94V‑0 flame retardant; withstands standard SMT reflow soldering temperature profile without deformation
4. Phosphor‑bronze contact terminals, selective nickel‑gold plating on contact interface; anti‑oxidation, lower contact resistance
5. Integrated card‑detect switch, supports hardware card‑insertion / removal detection for MCU logic judgment
6. Anti‑reverse‑insertion mechanical stop structure, prevents damage caused by wrong‑direction card insertion
7. SMT surface‑mount termination, fits mass‑production automatic pick‑and‑place equipment
8. Stainless‑steel shell for structural reinforcement & partial EMI shielding effect
9. Full compliance with RoHS environmental requirements; available for custom gold‑thickness, pin modification upon request

Product Advantages 

1. Middle‑pin layout differentiation: Most competing 1.5 H TF sockets use edge‑pin design; our middle‑pin layout releases PCB‑edge routing pressure, reduces signal‑trace crosstalk risk for high‑speed SDIO circuits, simplifies multi‑layer board layout work for hardware engineers.
2. UL94V‑0 LCP base as standard configuration: Many low‑cost alternatives adopt non‑V0 plastic; our default UL94V‑0 material helps customers pass product fire‑safety certification directly, eliminates extra material‑qualification workload.
3. Selective‑gold plating process: Gold only applied on critical contact zone instead of full‑part gold‑plating; balance reliable contact performance and BOM cost, avoid over‑expensive full‑gold solution.
4. Shorten‑type compact outline: Optimized outline dimension compared to standard‑length 1.5 H sockets; fit ultra‑slim enclosure design without sacrificing mechanical strength.
5. Stable mass‑production consistency: Strict coplanarity control ≤0.10 mm, lower soldering‑open‑circuit risk in SMT mass production; reduce after‑sales intermittent‑recognition complaints caused by poor coplanarity.
6. Flexible customization capability: Quick‑turn modification for card‑detect switch logic (NO/NC), gold thickness, partial pin omission; support pre‑sample before mass order for project validation.

FAQ 

Q1: Does this socket support UHS‑I high‑speed micro‑SD cards, large‑capacity cards (128 GB / 256 GB)?

Q2: What is the difference between middle‑pin and edge‑pin 1.5 H TF socket?

Q3: Can I use a normal‑temperature plastic‑version footprint for this UL94V‑0 socket?

Q4: My product has a vibration‑rich working environment; will card drop‑out happen?

Q5: What is your lead‑time for sample and mass production?

Q6: Can you adjust gold‑plating thickness or remove partial pins for a custom project?

Q7: What risk may happen if reflow soldering temperature exceeds 260 ℃ peak?